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(TOSHIBA)东芝光耦:DIP4(LF2)封装

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Specification of DIP4(LF2) package
Toshiba Code 11-5B202
Mounting Through Hole
Pins 4
Weight (typ.) 0.26 g
Packing Method Magazine
Minimum Quantity 100 pcs/Magazine
Package Dimensions (mm)

(TOSHIBA)东芝光耦:DIP4(LF2)封装

MagazineDimensions (mm)

(TOSHIBA)东芝光耦:DIP4(LF2)封装


Thickness: 0.5 mm

(TOSHIBA)东芝光耦:DIP4(LF2)封装


A: Magazine, B: Stopper

For TLP781 and TLP781F, please refer individual Datasheet.