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采用DIP16(LF1)封装的光耦

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采用DIP16(LF1)封装的光耦Specification of DIP16(LF1) package
Toshiba Code 11-20A301
Mounting Surface Mount
Pins 16
Weight (typ.) 1.1 g
Packing Method Magazine
Minimum Quantity 25 pcs/Magazine
Package Dimensions (mm)
/
Land Pattern Example (mm)

采用DIP16(LF1)封装的光耦

采用DIP16(LF1)封装的光耦

MagazineDimensions (mm)

采用DIP16(LF1)封装的光耦


Thickness: 0.5 mm

采用DIP16(LF1)封装的光耦


A: Magazine, B: Stopper